77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Industries · Applications
PCB & PCBA for Telecommunications
PCB and PCBA for communication equipment that combines RF sections with high-speed digital layers.
Applications
What Telecommunications projects need
Telecom hardware often needs RF and low-loss materials, controlled impedance and back drilling. Hybrid stack-ups are reviewed per design. This describes typical requirements and is not a customer reference.
- RF and low-loss materials
- Controlled impedance
- Back drilling
- Hybrid stack-ups
Typical applications and certificates
| Positioning | RF / Communication |
|---|---|
| Typical applications | 5G Base Stations, Routing & Switching, Optical Modules |
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Typical telecom and datacom modules
Typical requirements from the ShinePCB application capability sheet. Each project is reviewed against its own drawing and specification.
| End product / typical modules | Applicable PCB types | Key processes | Material direction | Engineering focus |
|---|---|---|---|---|
| 5G base station AAU / BBU / RRU — antenna, RF front end, baseband, clock, power | Hybrid high-frequency, high-speed multilayer, HDI, heavy copper | Hybrid lamination; impedance; back drilling; high layer count; press-fit holes; heavy copper | Rogers / Taconic; ultra-low-loss | Phase / impedance consistency; high-speed links; heat dissipation |
| Routers / switches / servers / storage — main board, switch board, backplane | High-speed multilayer, high-layer-count backplane, HDI, heavy copper | High-speed impedance; back drilling; press-fit holes; low-loss lamination | MEGTRON / Isola / TUC low-loss | 112G/224G links; insertion loss; crosstalk; warpage |
| Optical modules / CPO — DSP, driver/TIA, flex interconnect | HDI, high-speed multilayer, FPC, rigid-flex, ceramic | Ultra-fine lines; laser vias; via-in-pad; impedance; thin boards | Ultra-low-loss; LCP / FPC; ceramic | Low loss; miniaturization; thermal management; cleanliness |
Application descriptions show typical board requirements. They are not customer references, and end-product standards remain the responsibility of the product owner. TL9000 is not held; telecom quality clauses are reviewed per project.
Selected RF builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical products
Base station and antenna boards
Networking line cards
Optical and wireless modules
Telecommunications FAQs
Can you combine RF and digital layers?
Hybrid stack-ups are reviewed per design.
Do you support backplanes?
Yes. See backplane PCB.
